Method of forming semiconductor device including deep vias

ABSTRACT

A method (of manufacturing a semiconductor device) includes: forming via structures in a first via layer over a transistor layer; forming a first via structure of a first deep via arrangement in the first via layer; forming conductive segments in a first metallization layer over the first via layer; forming M_1st routing segments at least a majority of which, relative to a first direction, have corresponding long axes with lengths which at least equal if not exceed a first permissible minimum value for routing segments in the first metallization layer; forming an M_1st interconnection segment having a long axis which is less than the first permissible minimum value and which is included in the first deep via arrangement; and forming via structures in a second via layer over the first metallization layer, including forming a first via structure of the first deep via arrangement in the second via layer.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a continuation of U.S. patent application Ser. No.16/530,808, filed Aug. 2, 2019, now U.S. Pat. No. 11,127,673,that claimspriority to U.S. Provisional Patent Application Ser. No. 62/720,051filed Aug. 20, 2018, which are incorporated herein by reference in theirentireties.

BACKGROUND

An integrated circuit (“IC”) includes one or more semiconductor devices.One way in which to represent a semiconductor device is with a plan viewdiagram referred to as a layout diagram. Layout diagrams are generatedin a context of design rules. A set of design rules imposes constraintson the placement of corresponding patterns in a layout diagram, e.g.,geographic/spatial restrictions, connectivity restrictions, or the like.Often, a set of design rules includes a subset of design rulespertaining to the spacing and other interactions between patterns inadjacent or abutting cells where the patterns represent conductors in alayer of metallization.

Typically, a set of design rules is specific to a process technologynode by which will be fabricated a semiconductor device based on alayout diagram. The design rule set compensates for variability of thecorresponding process technology node. Such compensation increases thelikelihood that an actual semiconductor device resulting from a layoutdiagram will be an acceptable counterpart to the virtual device on whichthe layout diagram is based.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a block diagram, in accordance with some embodiments.

FIGS. 2A-2B are corresponding cross-sectional views, in accordance withsome embodiments.

FIGS. 3A-3F are corresponding layout diagrams, in accordance with someembodiments.

FIGS. 4A-4B are corresponding cross-sectional views, in accordance withsome embodiments.

FIG. 5 is a flowchart, in accordance with some embodiments.

FIGS. 6A-6B are corresponding flowcharts of corresponding methods, inaccordance with some embodiments.

FIG. 7 is a block diagram of an electronic design automation (EDA)system, in accordance with some embodiments.

FIG. 8 is a block diagram of an integrated circuit (IC) manufacturingsystem, and an IC manufacturing flow associated therewith, in accordancewith some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components, values, operations, materials,arrangements, or the like, are described below to simplify the presentdisclosure. These are, of course, merely examples and are not intendedto be limiting. Other components, values, operations, materials,arrangements, or the like, are contemplated. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate relationshipsbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The present disclosure describes at least one technique for addressingthe wiring/metallization congestion associated with an increased numberof pins for routing an input signal. The present disclosure describesone or more embodiments using metallization connections to alleviatecongestion produced by input pins and local routing used to implementthe input pins. Moreover, at least one technique described hereinalleviates violation of metallization minimum area rules by using deepvia structures to connect metallization layers.

FIG. 1 is a block diagram of a semiconductor device 100 in accordancewith some embodiments. In FIG. 1 , semiconductor device 100 includes,among other things, a circuit macro (hereinafter, macro) 102. In someembodiments, macro 102 is an SRAM macro. In some embodiments, macro 102is a macro other than an SRAM macro. Macro 102 includes, among otherthings, one or more cell regions 104A having a deep via structure in asingle-stack arrangement (see cross-section of FIG. 2A), and one or morecell regions 104B having two deep via structure in a double-stackarrangement (see cross-section of FIG. 2B). Examples of layout diagramswhich are used to fabricate cell regions 104A and/or 104B include thelayout diagrams disclosed herein.

FIG. 2A is a cross-sectional view of a portion 200A of a semiconductordevice, in accordance with some embodiments.

More particularly, in FIG. 2A, the cross-section of part 200A representsan interconnection architecture that includes a deep via structure240(1). Part 200A and the semiconductor device including the same arecorresponding examples of semiconductor device 100 and cell region 104Aof FIG. 1 .

Part 200A includes a transistor layer 202, a first (V_1st) layer 204 ofvia structures on transistor layer 202, and a first (M_1st) layer ofmetallization over the first (V_1^(st)) layer 204. Here, it will beassumed that the numbering convention of the corresponding design rulesof the corresponding semiconductor process technology node begins withthe V_1st layer and the M_1st layer being referred to correspondingly asV0 and M0. In some embodiments, the numbering convention begins with theV_1st layer and the M_1st layer being referred to correspondingly as V1and M1. Part 200A further includes: a V1 layer 208 over M0 layer 206;and a M1 layer 210 over V1 layer 208.

Transistor layer 202 includes: an active region 220(1); a gate structure224(1) and an interlayer dielectric (ILD) 226. Relative to a firstdirection, which is the Z-axis in FIG. 2A, gate structure 224(1) andsome portions of ILD 226 are located over active region 220(1). In someembodiments, the first direction is a direction of than the Z-axis. Insome embodiments, active region 220(1) is configured as one or more finsaccording to finFET technology. In some embodiments, active region220(1) is configured for planar transistor technology. In someembodiments, active region 220(1) is configured for a technology otherthan finFET or planar transistor technologies. In some embodiments,portions of active region 220(2), gate structure 224(2) and (again)active region 220(2) correspond to drain/source, gate and source/drainstructures of corresponding NMOS/PMOS transistors. A long axis of activeregion 220(1) extends along a first direction substantiallyperpendicular to the first direction. In FIG. 2A, the second directionis the X-axis. In some embodiments where the first direction is adirection other than the Z-axis, the second direction is a directionother than the X-axis. In FIG. 2A, a long axis of gate structure 224(1)extends along a third direction not shown that is substantiallyperpendicular to the first and second directions. In some embodiments,where the first direction and second directions are correspondingdirections other than correspondingly the Z-axis and the X-axis, thethird direction is a direction other than the Y-axis. In someembodiments, the gate structure 224 is polysilicon. In some embodiments,gate structure 224(1) is a material other than polysilicon.

For purposes of discussion including establishing a context fordiscussing the interconnection architecture which includes deep viastructure 240(1), V0 layer 204 includes a via structure 228(1), and M0layer 206 includes conductors 232(1) and 232(2). Relative to the X-axis,conductor 232(2) substantially overlaps via structure 228(1). Relativeto the X-axis, none of via 228(1), conductor 232(2) nor conductor 232(1)overlaps gate structure 224(1). Though included in part 200A,nevertheless none of via 228(1), conductor 232(2) nor conductor 232(1)represents a part of the interconnection architecture which includesdeep via structure 240(1).

Deep via structure 240(1) is located over gate structure 224(1).Relative to the Z-axis, deep via structure 240(1) spans V0 layer 204, M0layer 206 and V1 layer 208. In some embodiments, deep via structure240(1) is an example of a deep via structure referred to as a DV1structure. Deep via layer 240(1) includes portions 241(1), 241(2) and241(3) located correspondingly in V0 layer 204, M0 layer 206 and V1layer 208. In some embodiments, deep via structure 240(1) is an integralstructure. In some embodiments, portions 241(1), 241(2) and 241(3)represent corresponding discrete structures such that deep via structure240(1) is a composite structure. Portions 241(1), 241(2) and 241(3)represent conductive material in corresponding layers V0 layer 204, M0layer 206 and V1 layer 208.

Relative to a plane corresponding to the X-axis and the Y-axis (thelatter not shown in FIG. 2A), each of deep via structure 240(1) and viastructure 228(1) has a substantially square shape. The width W0 (alongthe X-axis) of deep via structure 240(1) along the X-axis issubstantially less than a minimum length Lmin0 of a majority of theconductors in layer M0 206. In some embodiments, W0 is substantiallyless than a minimum length Lmin0 of a majority of the conductors inlayer M0 206. In some embodiments, W0 is substantially less than aminimum length Lmin0 of about 80% of the conductors in layer M0 206. Insome embodiments, W0 is substantially less than a minimum length Lmin0of about 85% of the conductors in layer M0 206. In some embodiments,W0≤(≈Lmin0*X/2), where X is a unit of distance (length) measure. In someembodiments, X is contacted poly pitch (CPP) (see FIG. 3A) for thecorresponding semiconductor process technology node. In someembodiments, CPP≤(≈66 nm). In some embodiments, CPP≤(≈55 nm). In someembodiments, CPP≤(≈44 nm). In some embodiments,(≈Lmin0*X/6)≤W0≤(≈Lmin0*X/5). In some embodiments, Lmin0≈1.5*CPP. Insome embodiments, W0≈(1/3.3)*CPP, or 3W0≈(1/3.3)*CPP.

In terms of height along the Z-axis, deep via structure 240(1) issubstantially taller than via structure 228(1). Accordingly, viastructure 228(1) is a shallow via structure in comparison to deep viastructure 240(1). In some embodiments, shallow via structure 228(1) isan example of a shallow via structure referred to as a SV. Deep viastructure 240(1) has a first aspect ratio AR1 and shallow via structure228(1) has a second aspect ratio AR2. In some embodiments, the aspectratio of a structure is defined as the height (along the Z-axis) dividedby the width (along the X-axis). The first aspect ratio AR1 issubstantially greater than the second aspect ratio AR2. In someembodiments, a quotient Q is Q≈AR1/AR2 and 2 Q≤(≈2). In someembodiments, Q≈AR1/AR2≈10/3. In some embodiments, AR1≈5 and AR2≈1.5.

For a layout diagram (not shown) of the semiconductor process technologynode corresponding to the semiconductor device including part 200A, thelayout diagram including a level M0 of metallization corresponding tolayer M0 206, a design rule for level M0 (M0 design rule) mandates aminimum permissible length LM0 for conductive patterns corresponding tothe majority of conductors in layer M0 206, where LM0 corresponds toLmin0. A conductive pattern having a length less than LM0 violates theM0 design rule. In some embodiments, rather than a deep via patternwhich spans levels V0 204, M0 206 and V1 208 (see FIGS. 3C-3F) beingregarded in part as representing a conductive pattern in level M0 andthereby being a violation of the M0 design rule, the deep via pattern isnot regarded as a conductive pattern in level M0 and thereby avoidsviolating the M0 rule. In some embodiments, a deep via pattern whichspans levels V0 204, M0 206 and V1 208 is tagged in the layout diagramas representing in part an exempt conductive pattern in level M0,wherein such exempt conductive patterns in level M0 are exempted fromcompliance with the M0 design rule.

Returning to FIG. 2A, in some embodiments, conductor 242(1) representsan input/out conductor (pin) of a corresponding cell region. In someembodiments, a pin is contrasted with an intra-cell-region conductor. Apin is a type of conductor which carries an input/output (I/O) signal ofthe function of the corresponding cell region. An intra-cell conductoris a type of conductor which carries a signal which is internal to thecorresponding cell region. Compared to another approach which uses aconductor in layer M0 206 having a length of at least Lmin0, usinginstead portion 241(2) of deep via structure 240(1) according to atleast some embodiments consumes a substantially smaller area in layer M0206. A benefit of the smaller area in layer M0 206 which portion 241(2)of deep via structure 240(1) consumes is that congestion in layer M0 206is improved, which eases the challenge of routing in layer M0 206.

In a primary electrical path having a sequence starting from activeregion 220(1) and including active region 220(1), gate structure 224(1),deep via structure 240(1) and conductor 242(1), the use of deep viastructure 240(1) avoids otherwise having to include a conductor in layerM0 206 having a length of at least Lmin0, which reduces congestion inlayer M0 206.

In some embodiments, given that the first aspect ratio AR1 of deep viastructure 240(1) is substantially greater than the second aspect ratioAR2 of shallow via structure 228(1), appropriate material for deep viastructure 240(1) is different than for shallow via structure 228(1). Insome embodiments, appropriate material for shallow via structure 228(1)includes copper, copper alloy, tungsten, aluminum, gold or the like. Insome embodiments, appropriate material for deep via structure 240(1)includes ruthenium, cobalt, or the like.

In some embodiments, deep via structure 240(1) is a supervia describedin U.S. patent application Ser. No. 16/530,770, filed Aug. 2, 2019,entitled “Integrated Circuit Including Supervia And Method Of Making”(hereinafter the “1376U application”) which is incorporated herein byreference in its entirety.

In FIG. 2A, relative to the X-axis, deep via structure 240(1) issubstantially aligned over gate structure 224(1). In some embodiments,relative to the X-axis and the Y-axis (the latter not shown in FIG. 2A),deep via structure 240(1) is substantially aligned over gate structure224(1). In some embodiments, relative to the X-axis, deep via structure240(1) does not substantially overlap over gate structure 224(1);rather, gate structure 224(1) is not formed as tall along the Z-axis anda contact structure (not shown), having a long axis substantiallyparallel to the X-axis is formed between deep via structure 240(1) andgate structure 224(1), thereby electrically coupling deep via structure240(1) and gate structure 224(1).

FIG. 2B is a cross-sectional view of a portion 200B of a semiconductordevice, in accordance with some embodiments.

More particularly, in FIG. 2B, the cross-section of part 200B representsan interconnection architecture that includes a deep via structure240(2) and 258(1). Part 200B and the semiconductor device including thesame are corresponding examples of semiconductor device 100 and cellregion 104B of FIG. 1 .

Part 200B of FIG. 2B is similar to part 200A of FIG. 2A. Like FIG. 2A,in FIG. 2B, the first, second and third directions correspond to theZ-axis, X-axis and Y-axis; in some embodiments, the first, second andthird directions correspond to a different orthogonal coordinate system.For brevity, the discussion will focus more on differences between part200B and part 200A than on similarities. Elements of part 200B which aresimilar to elements of part 200A share the same main number but differin parenthetical number, e.g., active region 220(2) in part 200B issimilar to active region 220(1) in part 200A. Also, gate structure224(2) in part 200B is similar to gate structure 224(1) in part 200A.Deep via structure 240(2) in part 200B is similar to deep via 240(1) inpart 200A. Portions 241(4), 241(5) and 241(6) of deep via structure240(2) of part 200B are similar to corresponding portions 241(1), 241(2)and 241(3) of deep via structure 240(1) of part 200A.

In part 200B, for purposes of discussion including establishing acontext for discussing the interconnection architecture which includesdeep via structures 240(2) and 258(1), transistor layer 202 furtherincludes contacts 222(1) and 222(2), V0 layer 204 further includesshallow via structures 228(2) and 228(3), and M0 layer 206 includesconductors 232(3) and 232(4), and M2 layer 214 includes conductors250(1) and 250(2).

Relative to the X-axis, shallow via structure 228(2) substantiallyoverlaps MD 222(1), and shallow via structure 228(3) substantiallyoverlaps MD 222(2). Relative to the X-axis, conductor 232(3)substantially overlaps shallow via structure 228(2). Relative to theX-axis, conductor 232(4) substantially overlaps shallow via structure228(3). Though included in part 200B, nevertheless none of MDs 222(1)and 222(2), shallow via structures 228(2) and 228(3), nor conductors232(3) and 232(4) represents a part of the interconnection architecturewhich includes deep via structures 240(2) and 258(1).

Deep via structure 258(1) is located over conductor 242(2). Relative tothe Z-axis, deep via structure 258(1) spans V2 layer 212, M2 layer 214and V3 layer 216. In some embodiments, deep via structure 258(1) is anexample of a deep via structure referred to as a DV3 structure. Deep vialayer 258(1) includes portions 249(1), 249(2) and 249(3) locatedcorrespondingly in V2 layer 212, M2 layer 214 and V3 layer 216. In someembodiments, deep via structure 258(1) is an integral structure. In someembodiments, portions 249(1), 249(2) and 249(3) represent correspondingdiscrete structures such that deep via structure 258(1) is a compositestructure. Portions 249(1), 249(2) and 249(3) represent conductivematerial in corresponding layers V2 layer 212, M2 layer 214 and V3 layer216.

Relative to a plane corresponding to the X-axis and the Y-axis (thelatter not shown in FIG. 2B), each of deep via structure 258(1) andshallow via structures 228(1) has a substantially square shape. Thewidth W2 (along the X-axis) of deep via structure 258(1) along theX-axis is substantially less than a minimum length Lmin2 of a majorityof the conductors in layer M2 214. In some embodiments, W2 issubstantially less than minimum length Lmin2 of a majority of theconductors in layer M2 214. In some embodiments, W2 is substantiallyless than a minimum length Lmin2 of about 80% of the conductors in layerM2 214. In some embodiments, W2 is substantially less than a minimumlength Lmin2 of about 85% of the conductors in layer M2 214. In someembodiments, W2≤(=Lmin2*X/2), where X is a unit of distance (length)measure. In some embodiments, (=Lmin2*X/6)≤W2≤(≈Lmin2*X/5). In someembodiments, Lmin2≈1.5*CPP. In some embodiments, W2≈(1/3.3)*CPP, or3W2≈(1/3.3)*CPP.

In terms of height along the Z-axis, deep via structure 258(1) issubstantially taller than a shallow via structure, e.g., a via structure(not shown) in V2 212 or a via structure (not shown) in V3 216. Similarto deep via structure 240(2), deep via structure 258(1) has the firstaspect ratio AR1

For a layout diagram (not shown) of the semiconductor process technologynode corresponding to the semiconductor device including part 200B, thelayout diagram including level M0 of metallization corresponding tolayer M0 206 and a level M2 of metallization corresponding to layer M2214, a M0 design rule is similar to that discussed above in the contextof FIG. 2A, and a design rule for level M2 (M2 design rule) mandates aminimum permissible length LM2 for conductive patterns corresponding tothe majority of conductors in layer M2 214, where LM2 corresponds toLmin2. A conductive pattern having a length less than LM2 violates theM2 design rule. In some embodiments, rather than a deep via patternwhich spans levels V2 212, M2 214 and V3 216 (see FIGS. 3E-3F) beingregarded in part as representing a conductive pattern in level M2 andthereby being a violation of the M2 design rule, the deep via pattern isnot regarded as a conductive pattern in level M2 and thereby avoidsviolating the M2 rule. In some embodiments, a deep via pattern whichspans levels V2 212, M2 214 and V3 216 is tagged in the layout diagramas representing in part an exempt conductive pattern in level M2,wherein such exempt conductive patterns in level M2 are exempted fromcompliance with the M2 design rule.

Returning to FIG. 2B, in some embodiments, conductor 260(1) representsan input/out conductor (pin) of a corresponding cell region. Compared toanother approach which uses conductors in layers M0 206 and M2 214having corresponding lengths of at least Lmin0 and Lmin2, using insteadportions 241(5) and 249(2) of corresponding deep via structures 240(2)and 258(1) according to at least some embodiments consume substantiallysmaller corresponding areas in corresponding layers M0 206 and M2 214. Abenefit of the smaller areas in layers M0 206 and M2 214 whichcorresponding portions 241(5) of deep via structure 240(2) and 249(2) ofdeep via structure 258(1) consume is that congestion in correspondinglayers M0 206 and M0 214 is improved, which eases the challenges ofrouting in corresponding layers M0 206 and M2 214.

In a primary electrical path having a sequence starting from activeregion 220(2) and including active region 220(2), gate structure 224(2),deep via structure 240(2), conductor 242(2), deep via structure 258(1)and conductor 260(1), the use of deep via structures 240(2) and 258(1)avoids otherwise having to include conductors in corresponding layers M0206 and M2 214 having corresponding lengths of at least Lmin0 and Lmin2,which reduces congestion in corresponding layers M0 206 and M2 214.

Materials appropriate for deep via structures 240(2) and 258(1) aresimilar to the materials appropriate for deep via structure 240(1) ofFIG. 2A.

In some embodiments, deep via structure 258(1) is a supervia describedin the 1376U application (discussed above).

In FIG. 2B, relative to the X-axis, deep via structures 240(2) and258(1) are substantially aligned over gate structure 224(2). In someembodiments, relative to the X-axis and the Y-axis (the latter not shownin FIG. 2B), deep via structures 240(2) and 258(1) are substantiallyaligned over gate structure 224(2). In some embodiments, relative to theX-axis, deep via structure 240(2) does not substantially overlap overgate structure 224(2) nor align with deep via structure 258(1); however,each of deep via structure 240(2) and 258(1) overlaps conductor 242(1),and deep via structure 258(1) substantially overlaps gate structure224(2). Rather, gate structure 224(2) is not formed as tall along theZ-axis and a contact structure (not shown), having a long axissubstantially parallel to the X-axis is formed between deep viastructure 240(2) and gate structure 224(2), thereby electricallycoupling deep via structure 240(2) and gate structure 224(2).

In some embodiments, relative to the X-axis, deep via structure 258(1)does not substantially overlap over gate structure 224(2) norsubstantially aligns with deep via structure 240(2); however each ofdeep via structure 240(2) and 258(1) overlaps conductor 242(1), deep viastructure 240(2) substantially overlaps gate structure 224(2), and deepvia structure 258(1) substantially overlaps conductor 260(1). In someembodiments, relative to the X-axis, neither of deep via structures240(2) and 258(1) substantially overlaps over gate structure 224(2);however deep via structure 258(1) is substantially aligned over deep viastructure 240(2), each of deep via structure 240(2) and 258(1) overlapsconductor 242(1), and deep via structure 258(1) substantially overlapsconductor 260(1). In some embodiments, relative to the X-axis, neitherof deep via structures 240(2) and 258(1) substantially overlaps overgate structure 224(2), nor does deep via structure 258(1) substantiallyalign over deep via structure 240(2); however each of deep via structure240(2) and 258(1) overlaps conductor 242(1), and deep via structure258(1) substantially overlaps conductor 260(1).

FIGS. 3A-3F are corresponding layout diagrams 300A-300F, in accordancewith some embodiments.

FIGS. 4A-4B are corresponding cross-sectional views of parts 400A-400B,in accordance with some embodiments.

More particularly, layout diagrams 300A-300F are corresponding layoutdiagrams of corresponding standard cells 301A-301F which provide anAND-OR-INVERT (AOI) function. Each of layout diagrams 300B and 300C addcorresponding patterns relative to layout diagram 300A. Layout diagram300D adds patterns relative to layout diagram 300C. Layout diagram 300Eadds patterns relative to layout diagram 300D. Layout diagram 300F addspatterns relative to layout diagram 300E. A semiconductor device basedon one or more of layout diagram 300F includes a cell region whichrepresents an AOI circuit. In some embodiments, standard cell 301F oflayout diagram 300F is referred to as an AOI22 cell, where the 22denotes a two-input AND-function and a two-input OR function. An exampleof a semiconductor device based on layout diagram 300F is semiconductordevice 100 of FIG. 1 .

Also more particularly, parts 400A-400B in FIGS. 4A-4B are parts of asemiconductor device based on layout diagram 300F. Accordingly, FIGS.3A-3F and 4A-4B will be discussed together.

The numbering convention of FIGS. 3A-3F reflects that a semiconductordevice based on one or more of layout diagrams 300A-300F includesstructures which are similar to structures in FIGS. 2A-2B. Whileelements in FIGS. 3A-3E use 3-series numbering and elements of FIGS.2A-2B use 2-series numbering, a similarity between an element in FIGS.3A-3E and corresponding elements in FIGS. 2A-2B is reflected in the useof a similar main portion of the reference number, with the differencebeing reflected in the parenthetical portion of the reference number.For example, active area pattern 320(3) of FIG. 3A represents an activeregion in a semiconductor device based on layout diagram 300A which issimilar to active regions 220(1) of FIG. 2A and 220 (2) of FIG. 2B.Here, the similarity is reflected in the main portion “X20” of thereference number, where X=3 for 320(3) of FIG. 3A and X=2 for 220(1) ofFIG. 2A and 220 (2) of FIG. 2B. Also, here, differences are reflected inthe parenthetical portion (3) for 320(3) of FIG. 3A as contrasted with(1) for 220(1) of FIG. 2A and 220 (2) of FIG. 2B.

Likewise, the numbering convention of FIGS. 4A-4B reflects that parts400A-400B of corresponding FIGS. 4A-4B include structures which aresimilar to structures in FIGS. 2A-2B. While elements in FIGS. 4A-4B use4-series numbering and elements of FIGS. 2A-2B use 2-series numbering, asimilarity between an element in FIGS. 4A-4B and corresponding elementsin FIGS. 2A-2B is reflected in the use of a similar main portion of thereference number, with the difference being reflected in theparenthetical portion of the reference number. For example, activeregion 420(4) of FIG. 4B is similar to active region 220(1) of FIG. 2A.Here, the similarity is reflected in the main portion “X20” of thereference number, where X=4 for 420(4) of FIG. 4B and X=2 for 220(1) ofFIG. 2A. Also, here, differences are reflected in the parentheticalportion (4) for 420(4) of FIG. 4B as contrasted with (1) for 220(1) ofFIG. 2A.

The numbering convention of FIGS. 4A-4B also reflects that correspondingparts 400A-400B are included in a semiconductor device based on layoutdiagram 300F. While elements in FIGS. 4A-4B use 4-series numbering andelements of FIGS. 3A-3E use 3-series numbering, a similarity between anelement in FIGS. 4A-4B and corresponding element in FIGS. 3A-3E isreflected in the use of a similar main portion of the reference numberand a similar parenthetical portion of the reference number. Forexample, active area pattern 320(3) of FIG. 3A represents active region420(3) in part 200A. Here, the similarity is reflected in the mainportion “X20” of the reference number, where X=3 for 320(3) of FIG. 3Aand X=4 for 420(3) of FIG. 4A, and in the parenthetical portion (3) for320(3) of FIG. 3A and (3) for 420(3) of FIG. 4A.

FIGS. 3A-3E assume an orthogonal XYZ coordinate system in which theX-axis, Y-axis and Z-axis represent corresponding first, second andthird directions. In some embodiments, the first, second and thirddirections correspond to a different orthogonal coordinate system thanthe XYZ coordinate system.

In FIG. 3A, layout diagram 300A includes: active area patterns 320(3)(as alluded to above) and 320(4); MD patterns 322(3), 322(4), 322(5),322(6), 322(7), 322(8), 322(9), 322(10), 322(11) and 322(12); gatepatterns 324(3), 324(4), 324(5), 434(6), 324(7) and 324(8); shallow viapatterns 328(4), 328(5), 328(6), 328(7), 328(8) and 328(9); andconductive patterns 332(5), 332(6), 332(7) and 332(8). Conductivepatterns 332(5) and 332(8) are designated for first and second referencevoltages, which are correspondingly voltages VDD and VSS in FIGS. 3A-3F.In some embodiments, conductive patterns 332(5) and 332(8) aredesignated for first and second reference voltages other thancorrespondingly voltages VDD and VSS.

Active area patterns 320(3)-320(4), MD patterns 322(3)-322(12), and gatepatterns 324(3)-324(8) are included in a transistor level of layoutdiagrams 300A-300E, where the transistor level represents a transistorlayer in a semiconductor device based on one or more of layout diagrams300A-300E. Active region 420(3) of FIG. 4A is an example of an activeregion in a semiconductor device based on active area pattern 320(3) inlayout diagram 300F.

Shallow via patterns 328(4)-328(9) are included in a V0 level of layoutdiagrams 300A-300F, where the V0 level represents a V0 layer in asemiconductor device based on one or more of layout diagrams 300A-300F.Shallow via structure 428(4) is an example of a shallow via structurebased on shallow via pattern 328(4) in layout diagram 300F.

Conductive patterns 332(5), 332(6), 332(7) and 332(8) are included in aM0 level of layout diagrams 300A-300F, where the M0 level represents aM0 layer in a semiconductor device based on layout diagrams 300A-300F.Conductor 432(6) in FIG. 4A is an example of a conductor based onconductive pattern 332(6) in layout diagram 300F.

In FIG. 3A, active area patterns 320(3)-320(4) have corresponding longaxes extending substantially along the X-axis (extending horizontally).MD patterns 322(3)-322(12), and gate patterns 324(3)-324(8) are disposedover corresponding active area patterns 320(3)-320(4), and havecorresponding long axes extending substantially along the Y-axis(extending vertically). Relative to the X-axis, MD patterns322(3)-322(12) are interspersed amongst corresponding gate patterns324(3)-324(8).

Shallow via patterns 328(4)-328(9) are disposed over corresponding MDpatterns 322(3), 322(4), 322(5), 322(7), 322(10) and 322(6). Conductivepatterns 332(5), 332(6), 332(7) and 332(8) are disposed overcorresponding MD patterns 322(3)-322(12), and gate patterns 324(4),324(5), 434(6) and 324(7), and have corresponding long axes extendingsubstantially along the X-axis (extending horizontally).

Relative to the X-axis gate patterns 324(3)-324(8) are separated by adistance representing one CPP, e.g., gate patterns 324(6) and 324(7) areseparated by one CPP. Accordingly, relative to the X-axis, a widthCW301A of cell 301A is CW301A=5 CPP.

As cell 301A is an AOI cell, cell 301A has inputs A1, A2, B1 and B2, anoutput ZN, and an internal node n1. Gate patterns 324(4)-324(7) aredesignated to receive corresponding inputs A1, A2, B1 and B2. MD pattern322(6) is designated to provide output ZN.

In some embodiments, a first M0 design rule for layout diagrams300A-300F is the M0 design rule discussed above, for which LM0≈1.5*CPP.In some embodiments, relative to the X-axis, a second M0 design rule isthat ends of neighboring and otherwise-abutting conductive patterns mustbe separated by a gap having a size G0. In some embodiments, G0≈0.5CPP.In some embodiments, where CPP≤(≈66 nm), G0≤(≈33 nm). In someembodiments, where CPP≤(≈55 nm), G0≤(≈22.5 nm). In some embodiments,where CPP≤(≈44 nm), G0≤(≈22 nm). If shallow via patterns were to be usedto diagrammatically couple gate patterns 324(4)-324(7) to correspondingconductive patterns in level M0, and in order to comply with the firstand second M0 design rules, then cell 301A is widened by one CPPresulting in cell 301B of FIG. 3B, where the increase in width is notedby reference numeral 370 in FIG. 3B. Cell 301B is widened due tocongestion in level M0.

In layout diagram 300B of FIG. 3B, patterns have been added relative tolayout diagram 300A of FIG. 3A. In particular, due to congestion inlevel M0, gate pattern 324(9), MD patterns 322(13)-322(14), shallow viapatterns 328(10), 328(11), 328(12), 328(13), 328(14) and 328(15), andconductive patterns 332(9), 332(10) and 332(11) have been added in orderto comply with the first and second M0 design rules. Also, relative tothe X-axis, conductive pattern 332(7)′ has been widened in cell 301B ascontrasted with conductive pattern 332(7) of cell 301A. As a result, awidth CW301B of cell 301B being CW301B=6 CPP. Cell 301B is increased inwidth by about 20% as compared to cell 301A.

Cell 301B of FIG. 3B does not reflect an interconnection architecture(according to at least some embodiments) which includes a deep viapattern. To relieve congestion in level M0, and in order to comply withthe first and second M0 design rules, and yet to avoid a resultant cellwhich is wider than cell 301A, cell 301C of layout diagram 300C adds adifferent set of patterns to cell 301A of layout 300A than are added bycell 301B of layout diagram 300B.

In FIG. 3C, cell 301C of layout diagram 300C does not reflect aninterconnection architecture (according to at least some embodiments)which includes at least one deep via pattern. Similarly, cells 301D-301Fof corresponding layout diagrams 300D-300F reflect correspondinginterconnection architectures (according to at least some embodiments)which include at least one deep via pattern.

More particularly, in FIG. 3C, deep via patterns representingcorresponding DV1 structures, namely deep via patterns 340(3), 340(4),340(5) and 340(6), have been added to cell 301C. In some embodiments,relative to the X-axis, a size D0 of each of deep via patterns340(3)-340(6) is D0≤(≈LM0*X/2), where X is a unit of distance (length)measure, and D0 corresponds to W0 (see FIG. 2A). In some embodiments,(≈LM0*X/6)≤D0≤(≈LM0*X/5). In some embodiments, LM0≈1.5*CPP. In someembodiments, D0≈(1/3.3)*CPP, or 3D0≈(1/3.3)*CPP. Each of deep viapatterns 340(3)-340(6) represent conductive material correspondinglyincluded in V0 layer 204, M0 layer 206 and V1 layer 208 of asemiconductor device based on layout diagrams 300C-300F. Deep viastructure 424(3) of FIG. 4B is an example of a deep via structure basedon deep via pattern 340(3) in layout diagram 300C. Deep via structure424(3) includes portions 441(7), 441(8) and 441(9) in corresponding V0layer 204, M0 layer 206 and V1 layer 208. Relative to the X-axis, deepvia patterns 340(3)-340(6) have been disposed to overlap correspondinggate patterns 324(4)-324(7). Relative to the Y-axis, deep via patterns340(3)-340(6) have been disposed to overlap active area pattern 320(4).

In FIG. 3D, conductive patterns 342(3), 342(4), 342(5) and 342(6) havebeen added to cell 301D. Conductive patterns 342(3), 342(4), 342(5) and342(6) are included in a M1 level of layout diagrams 300D-300F, wherethe M1 level represents a M1 layer in a semiconductor device based onlayout diagrams 300D-300F. Conductor 442(3) in FIGS. 4A-4B is an exampleof a conductor based on conductive pattern 342(3) in layout diagram300F.

Conductive patterns 342(3)-342(6) are disposed over corresponding deepvia patterns 340(3)-340(6) and gate patterns 324(4)-324(7), and havecorresponding long axes extending substantially along the Y-axis(extending vertically). Relative to the X-axis, conductive patterns342(3)-342(6) substantially overlap corresponding deep via patterns340(3)-340(6).

In some embodiments, a first M2 design rule for layout diagrams300D-300F is the M2 design rule discussed above, for which LM2≈1.5*CPP.In some embodiments, relative to long axes of conductive patterns inlevel M2, a second M2 design rule is that ends of neighboring andotherwise-abutting conductive patterns must be separated by a gap havinga size G2. In some embodiments, to relieve congestion in level M2, andin order to comply with the first and second M2 design rules, deep viapatterns representing corresponding DV3 structures are added to cell300E of FIG. 3E.

In FIG. 3E, more particularly, deep via patterns 358(2), 358(3), 358(4)and 358(5) have been added to cell 301D. In some embodiments, relativeto the X-axis, a size D2 of each of deep via patterns 358(2)-358(5) isD2≤(≈LM2*X/2), where D2 corresponds to W2 (see FIG. 2B). In someembodiments, (≈LM2*X/6)≤D2≤(≈LM2*X/5). In some embodiments, LM2≈1.5*CPP.In some embodiments, D2≈(1/3.3)*CPP, or 3D2≈(1/3.3)*CPP. Each of deepvia patterns represent conductive material correspondingly included inV2 layer 212, M2 layer 214 and V3 layer 216 of a semiconductor devicebased on layout diagrams 300E-300F. Deep via structure 458(2) of FIG. 4Ais an example of a deep via structure based on deep via pattern 358(2)in layout diagram 300E. Deep via structure 458(2) includes portions449(4), 449(5) and 449(6) in corresponding V2 layer 212, M2 layer 214and V3 layer 216. Relative to the X-axis, deep via patterns358(2)-358(5) have been disposed to overlap corresponding conductivepatterns 342(3)-342(6). Relative to the Y-axis, deep via patterns340(3)-340(6) have been disposed to overlap active area pattern 320(3).

In FIG. 3F, conductive patterns 360(2), 360(3), 360(4) and 360(5) havebeen added to cell 301F. Conductive patterns 360(2)-360(5) are includedin a M3 level of layout diagram 300F, where the M3 level represents a M3layer in a semiconductor device based on layout diagram 300F. Conductor460(2) in FIGS. 4A-4B is an example of a conductor based on conductivepattern 360(2) in layout diagram 300F.

Conductive patterns 360(2)-360(5) are disposed over corresponding deepvia patterns 358(2)-358(5) and conductive patterns 342(3)-342(6), andhave corresponding long axes extending substantially along the Y-axis(extending vertically). Relative to the X-axis, conductive patterns360(2)-360(5) substantially overlap corresponding deep via patterns358(2)-358(5).

Cells 301C-301F of FIGS. 3C-3F reflect an interconnection architecture(according to at least some embodiments) which includes at least onedeep via pattern. Using such an architecture, cells 301C-301F relievecongestion in level M0 while complying with the first and second M0design rules, and while retaining a cell width that is no wider thancell 301A. Compared to cell 301B, each of cells 301C-301F is about 20%narrower. Also, using such an architecture, cells 301E-301F relievecongestion in level M2 while complying with the first and second M2design rules, and while retaining a cell width that is no wider thancell 301A. Compared to cell 301B, each of cells 301E-301F is about 20%narrower.

In FIG. 3F, AOI22 cell 301F is an example of a high pin-count cell whichsuffers congestion in level M0 and/or level M2, and which benefits fromusing an interconnection architecture (according to at least someembodiments) which includes at least one deep via pattern. Examples ofother high pin-count standard cells that similarly benefit from using aninterconnection architecture (according to at least some embodiments,which includes at least one deep via pattern) include: AOI 33, AOI44, orthe like; OR-AND-INVERT (OAI) cells such as OAI22, OAI33, OAI44, or thelike; NAND4, NAND5, or the like; NOR4, NOR5, or the like.

FIG. 5 is a flowchart of a method 500 of manufacturing a semiconductordevice, in accordance with one or more embodiments.

Examples of a semiconductor device which can be manufactured accordingto method 500 include semiconductor device 100 FIG. 1 , and thesemiconductor devices for which parts 200A of FIG. 2A, 200B of FIG. 2B,400A of FIG. 4A and 400B of FIG. 4B are correspondingly includedtherein, or the like.

In FIG. 5 , method 500 includes blocks 502-504. At block 504, a layoutdiagram is generated which reflects an interconnection architecture(according to at least some embodiments) which includes at least onedeep via pattern. Block 502 is discussed in more detail below withrespect to FIGS. 6A-6B. From block 502, flow proceeds to block 504.

At block 504, based on the layout diagram, at least one of (A) one ormore semiconductor masks or (B) at least one component in a layer of asemiconductor device is fabricated. See discussion below of FIG. 8 . Insome embodiments, the fabricating further includes performing one ormore lithographic exposures based on the revised layout diagram.

FIG. 6A is a flowchart of a method of generating a layout diagram, inaccordance with one or more embodiments.

More particularly, the method of FIG. 6A shows block 502 of FIG. 5 inmore detail, in accordance with one or more embodiments.

Examples of layout diagrams which can be generated according to themethod of FIG. 6A include the layout diagrams disclosed herein, or thelike. In some embodiments, the layout diagram and versions thereof arestored on a non-transitory computer-readable medium, e.g., stored aslayout diagram(s) 708 in computer-readable medium 704 in FIG. 7(discussed below). The method of FIG. 6A is implementable, for example,using EDA system 700 (FIG. 7 , discussed below), in accordance with someembodiments. Examples of a semiconductor device which can bemanufactured based on layout diagrams generated according to the methodof FIG. 6A include semiconductor device 100 FIG. 1 , and thesemiconductor devices for which parts 200A of FIG. 2A, 200B of FIG. 2B,400A of FIG. 4A and 400B of FIG. 4B are correspondingly includedtherein, or the like.

In FIG. 6A, block 502 includes blocks 610-630. At block 610, firstconductive patterns are generated which represent correspondingconductive material in a first metallization (M_1st layer) of asemiconductor device. An example of the M_1st layer is layer M0 206 inFIGS. 4A-4B, which corresponds to level M0 in the layout diagram.Examples of the first conductive patterns include conductive patterns332(5)-332(8) of FIGS. 3A-3F. From block 610, flow proceeds to block612.

At block 612, a first deep via pattern is generated which representsconductive material in the second via layer, M_1st layer, and first vialayer of a semiconductor device. Examples of the first and second vialayers are corresponding layers V0 204 and V1 208 in FIGS. 4A-4B.Examples of the first deep via pattern are deep via patterns 340(3),340(4), 340(5) and 340(6) of FIGS. 3C-3F. From block 612, flow proceedsto block 614.

At block 614, the first deep via pattern is aligned to overlap anunderlying target. An example of the target is a corresponding componentpattern representing conductive material included in an electrical pathof a terminal of a corresponding transistor in the transistor layer.Other examples of the target are gate patterns 324(4)-324(7) in FIGS.3C-3F. From block 614, flow proceeds to block 616.

At block 616, the size of the deep via pattern is configured to besubstantially less than a permissible minimum length of a conductivepattern in level M_1st. Examples of the size of the deep via patternbeing less than the permissible minimum length of a conductive patternin level M_1st include the size D0 of each of deep via patterns340(3)-340(6) in FIGS. 3C-3D being D0≤(≈LM0*X/2). From block 616, flowproceeds to block 618.

At block 618, a conductive pattern is generated which representsconductive material in the second metallization (M_2nd) layer of asemiconductor device. An example of the M_2nd layer is layer M1 210 inFIGS. 4A-4B, which corresponds to level M1 in the layout diagram.Examples of the second conductive pattern include conductive patterns342(3)-342(6) of FIGS. 3D-3F. From block 618, flow proceeds to block620.

At block 620, the second conductive pattern is aligned to overlap thefirst deep via pattern. Examples of the second conductive pattern beingaligned to overlap the first deep via pattern include conductivepatterns 342(3)-342(6) of FIGS. 3D-3F being aligned to overlapcorresponding deep via patterns 340(3)-340(6). From block 620, flowproceeds to block 622.

At block 622, a second deep via pattern is generated which representsconductive material in the third via layer, M_3rd layer, and fourth vialayer of a semiconductor device. Examples of the third and fourth vialayers are corresponding layers V2 212 and V3 216 in FIGS. 4A-4B.Examples of the second deep via pattern are deep via patterns358(2)-358(5) of FIGS. 3E-3F. From block 622, flow proceeds to block624.

At block 624, the second deep via pattern is aligned to overlap thesecond conductive pattern. Examples of the second deep via pattern beingaligned to overlap the second conductive pattern include deep viapatterns 358(2)-358(5) being aligned to overlap corresponding conductivepatterns 342(3)-342(6) as in FIGS. 3E-3F. From block 624, flow proceedsto block 626.

At block 626, the second deep via pattern is aligned to overlap thefirst deep via pattern. Examples of the second deep via pattern beingaligned to overlap the first deep via pattern include deep via patterns358(2)-358(5) being aligned to overlap corresponding deep via patterns340(3)-340(6), relative to the Y-axis, as in FIGS. 3E-3F. In someembodiments, the second deep via pattern is aligned to overlap the firstdeep via pattern with respect to each of the X-axis and the Y-axis. Fromblock 626, flow proceeds to block 628.

At block 628, a third conductive pattern is generated which representsconductive material in the fourth metallization (M_4th) layer of asemiconductor device. An example of the M_4th layer is layer M3 218 inFIGS. 4A-4B, which corresponds to level M3 in the layout diagram.Examples of the third conductive pattern include conductive patterns360(2)-360(5) of FIG. 3F. From block 628, flow proceeds to block 630.

At block 630, the third conductive pattern is aligned to overlap thesecond deep via pattern. Examples of the second conductive pattern beingaligned to overlap the second deep via pattern include conductivepatterns 360(2)-360(5) of FIG. 3F being aligned to overlap correspondingdeep via patterns 358(2)-358(5).

FIG. 6B is a flowchart of a method of generating a layout diagram, inaccordance with one or more embodiments.

More particularly, the method of FIG. 6B shows block 502 of FIG. 5 inmore detail, in accordance with one or more embodiments.

Examples of layout diagrams which can be generated according to themethod of FIG. 6B include the layout diagrams disclosed herein, or thelike. In some embodiments, the layout diagram and versions thereof arestored on a non-transitory computer-readable medium, e.g., stored aslayout diagram(s) 708 in computer-readable medium 704 in FIG. 7(discussed below). The method of FIG. 6B is implementable, for example,using EDA system 700 (FIG. 7 , discussed below), in accordance with someembodiments. Examples of a semiconductor device which can bemanufactured based on layout diagrams generated according to the methodof FIG. 6B include semiconductor device 100 FIG. 1 , and thesemiconductor devices for which parts 200A of FIG. 2A, 200B of FIG. 2B,400A of FIG. 4A and 400B of FIG. 4B are correspondingly includedtherein, or the like.

In FIG. 6B, block 502 includes blocks 650-656. At block 650, a firstdeep via pattern is generated which represents a first via structure ina semiconductor device, the first via structure having first, second andthird portions of conductive material in the first via layer, M(i)layer, and second via layer of a semiconductor device, where i is aninteger and 0≤i. Examples of the first and second via layers arecorresponding layers V0 204 and V1 208 in FIGS. 4A-4B. An example of theM(i) layer is M0 layer 206 in FIGS. 4A-4B. An example of the first deepvia pattern is deep via pattern 340(3) in FIGS. 3C-3F. An example of acorresponding deep via structure is deep via structure 440(3) in FIG.4B. Deep via structure 440(3) includes portions 441(7), 441(8) and441(9) in corresponding layers V0 204, M0 206 and V1 208. From block650, flow proceeds to block 652.

At block 652, a first conductive pattern in the transistor level of thelayout diagram is diagrammatically coupled (through a first diagrammaticpath) with a second conductive pattern in a M(i+1) level of the layoutdiagram using the first deep via pattern. The first diagrammatic pathrepresents a first primary electrical path in the semiconductor device.

The first primary electrical path uses a first deep via structure toelectrically couple the first conductive structure in the transistorlayer with the second conductive structure in the layer M(i+1). Examplesof the first and second conductive patterns are correspondingly gatepattern 324(3) in the transistor level and conductive pattern 342(3) incorresponding FIGS. 3D-3F. Examples of corresponding first and secondconductive structures include gate structure 424(3) and conductor 442(3)in FIG. 4B.

The first deep via pattern, if otherwise regarded in part asrepresenting a conductive pattern in the M(i) level which corresponds tothe second portion in the M(i) layer, then would be short enough toviolate a minimum length design rule for a permissible conductivepattern in the M(i) level. An example of the M(i) level is the M0 levelof the layout diagram, which corresponds to the M0 layer of asemiconductor device. An example of the M0 layer of a semiconductordevice is M0 layer 206 of FIGS. 4A-4B. An example of the minimum lengthdesign rule for a permissible conductive pattern in the M(i) level isthe first M0 design rule (discussed above), which has minimum lengthLM0. An example of the first deep via pattern, if otherwise regarded inpart as representing a conductive pattern in the M(i) level, then beingbe short enough to violate the minimum length design rule for apermissible conductive pattern in the M(i) level, is deep via pattern340(3) of FIGS. 3C-3F having, relative to the X-axis, size D0, whereD0≤(≈LM0*X/2) in some embodiments. Again, in some embodiments,(≈LM0*X/6)≤D0≤(≈LM0*X/5). From block 652, flow proceeds to block 654.

At block 654, a second deep via pattern is generated which represents asecond via structure in a semiconductor device, the second via structurehaving first, second and third portions of conductive material in thethird via layer, M(i+2) layer, and fourth via layer of a semiconductordevice. Examples of the third and fourth via layers are correspondinglayers V2 212 and V3 216 in FIGS. 4A-4B. An example of the M(i+1) layeris M1 layer 210 in FIGS. 4A-4B. An example of the first deep via patternis deep via pattern 358(2) in FIGS. 3E-3F. An example of a correspondingdeep via structure is deep via structure 458(2) in FIG. 4A. Deep viastructure 458(2) includes portions 449(4), 449(5) and 449(6) incorresponding layers V2 212, M2 214 and V3 216. From block 654, flowproceeds to block 656.

At block 656, a second conductive pattern in the M(+1) level of thelayout diagram is diagrammatically coupled (through a seconddiagrammatic path) with a third conductive pattern in a M(i+3) level ofthe layout diagram using the second deep via pattern. The seconddiagrammatic path represents a second primary electrical path in thesemiconductor device.

The second primary electrical path uses a second deep via structure toelectrically couple the second conductive structure in the M(i+1) layerwith the third conductive structure in the layer M(i+3). Examples of thesecond and third conductive patterns are correspondingly conductivepattern 342(3) and conductive pattern 360(2) in FIG. 3F. Examples ofcorresponding second and third conductive structures conductors 442(3)and 460(2) in FIG. 4A.

The second deep via pattern, if otherwise regarded in part asrepresenting a conductive pattern in the M(i+2) level which correspondsto the second portion in the M(i+2) layer, then would be short enough toviolate a minimum length design rule for a permissible conductivepattern in the M(i+2) level. An example of the M(i+2) level is the M2level of the layout diagram, which corresponds to the M2 layer of asemiconductor device. An example of the M2 layer of a semiconductordevice is M2 layer 214 of FIGS. 4A-4B. An example of the minimum lengthdesign rule for a permissible conductive pattern in the M(i+2) level isthe first M2 design rule (discussed above), which has minimum lengthLM2. An example of the second deep via pattern, if otherwise regarded inpart as representing a conductive pattern in the M(i+2) level, thenbeing be short enough to violate the minimum length design rule for apermissible conductive pattern in the M(i+2) level, is deep via pattern358(2) of FIGS. 3E-3F having, relative to the X-axis, size D2, whereD2≤(≈LM2*X/2) in some embodiments. Again, in some embodiments,(≈LM2*X/6)≤D2≤(≈LM2*X/5).

FIG. 7 is a block diagram of an electronic design automation (EDA)system 700, in accordance with some embodiments.

In some embodiments, EDA system 700 includes an automatic placement androuting (APR) system. Methods described herein of generating PG layoutdiagrams, in accordance with one or more embodiments, are implementable,for example, using EDA system 700, in accordance with some embodiments.

In some embodiments, EDA system 700 is a general purpose computingdevice including a hardware processor 702 and a non-transitory,computer-readable storage medium 704. Storage medium 704, amongst otherthings, is encoded with, i.e., stores, computer program code 706, i.e.,a set of executable instructions. Execution of instructions 706 byhardware processor 702 represents (at least in part) an EDA tool whichimplements a portion or all of a method according to an embodiment,e.g., the methods described herein in accordance with one or moreembodiments (hereinafter, the noted processes and/or methods).

Processor 702 is electrically coupled to computer-readable storagemedium 704 via a bus 708. Processor 702 is also electrically coupled toan I/O interface 710 by bus 708. A network interface 712 is alsoelectrically connected to processor 702 via bus 708. Network interface712 is connected to a network 714, so that processor 702 andcomputer-readable storage medium 704 are capable of connecting toexternal elements via network 714. Processor 702 is configured toexecute computer program code 706 encoded in computer-readable storagemedium 704 in order to cause system 700 to be usable for performing aportion or all of the noted processes and/or methods. In one or moreembodiments, processor 702 is a central processing unit (CPU), amulti-processor, a distributed processing system, an applicationspecific integrated circuit (ASIC), and/or a suitable processing unit.

In one or more embodiments, computer-readable storage medium 704 is anelectronic, magnetic, optical, electromagnetic, infrared, and/orsemiconductor system (or apparatus or device). For example,computer-readable storage medium 704 includes a semiconductor orsolid-state memory, a magnetic tape, a removable computer diskette, arandom access memory (RAM), a read-only memory (ROM), a rigid magneticdisk, and/or an optical disk. In one or more embodiments using opticaldisks, computer-readable storage medium 704 includes a compact disk-readonly memory (CD-ROM), a compact disk-read/write (CD-R/W), and/or adigital video disc (DVD).

In one or more embodiments, storage medium 704 stores computer programcode (instructions) 706 configured to cause system 700 (where suchexecution represents (at least in part) the EDA tool) to be usable forperforming a portion or all of the noted processes and/or methods. Inone or more embodiments, storage medium 704 also stores informationwhich facilitates performing a portion or all of the noted processesand/or methods. In one or more embodiments, storage medium 704 storeslibrary 707 of standard cells including such standard cells as disclosedherein and one or more layout diagrams 708 such as are disclosed herein.

EDA system 700 includes I/O interface 710. I/O interface 710 is coupledto external circuitry. In one or more embodiments, I/O interface 710includes a keyboard, keypad, mouse, trackball, trackpad, touchscreen,and/or cursor direction keys for communicating information and commandsto processor 702.

EDA system 700 also includes network interface 712 coupled to processor702. Network interface 712 allows system 700 to communicate with network714, to which one or more other computer systems are connected. Networkinterface 712 includes wireless network interfaces such as BLUETOOTH,WIFI, WIMAX, GPRS, or WCDMA; or wired network interfaces such asETHERNET, USB, or IEEE-1364. In one or more embodiments, a portion orall of noted processes and/or methods, is implemented in two or moresystems 700.

System 700 is configured to receive information through I/O interface710. The information received through I/O interface 710 includes one ormore of instructions, data, design rules, libraries of standard cells,and/or other parameters for processing by processor 702. The informationis transferred to processor 702 via bus 708. EDA system 700 isconfigured to receive information related to a UI through I/O interface710. The information is stored in computer-readable medium 704 as userinterface (UI) 742.

In some embodiments, a portion or all of the noted processes and/ormethods is implemented as a standalone software application forexecution by a processor. In some embodiments, a portion or all of thenoted processes and/or methods is implemented as a software applicationthat is a part of an additional software application. In someembodiments, a portion or all of the noted processes and/or methods isimplemented as a plug-in to a software application. In some embodiments,at least one of the noted processes and/or methods is implemented as asoftware application that is a portion of an EDA tool. In someembodiments, a portion or all of the noted processes and/or methods isimplemented as a software application that is used by EDA system 700. Insome embodiments, a layout diagram which includes standard cells isgenerated using a tool such as VIRTUOSO® available from CADENCE DESIGNSYSTEMS, Inc., or another suitable layout generating tool.

In some embodiments, the processes are realized as functions of aprogram stored in a non-transitory computer readable recording medium.Examples of a non-transitory computer readable recording medium include,but are not limited to, external/removable and/or internal/built-instorage or memory unit, e.g., one or more of an optical disk, such as aDVD, a magnetic disk, such as a hard disk, a semiconductor memory, suchas a ROM, a RAM, a memory card, and the like.

FIG. 8 is a block diagram of an integrated circuit (IC) manufacturingsystem 800, and an IC manufacturing flow associated therewith, inaccordance with some embodiments. In some embodiments, based on a layoutdiagram, at least one of (A) one or more semiconductor masks or (B) atleast one component in a layer of a semiconductor integrated circuit isfabricated using manufacturing system 800.

In FIG. 8 , IC manufacturing system 800 includes entities, such as adesign house 820, a mask house 830, and an IC manufacturer/fabricator(“fab”) 850, that interact with one another in the design, development,and manufacturing cycles and/or services related to manufacturing an ICdevice 860. The entities in system 800 are connected by a communicationsnetwork. In some embodiments, the communications network is a singlenetwork. In some embodiments, the communications network is a variety ofdifferent networks, such as an intranet and the Internet. Thecommunications network includes wired and/or wireless communicationchannels. Each entity interacts with one or more of the other entitiesand provides services to and/or receives services from one or more ofthe other entities. In some embodiments, two or more of design house820, mask house 830, and IC fab 850 is owned by a single larger company.In some embodiments, two or more of design house 820, mask house 830,and IC fab 850 coexist in a common facility and use common resources.

Design house (or design team) 820 generates an IC design layout diagram822. IC design layout diagram 822 includes various geometrical patternsdesigned for an IC device 860. The geometrical patterns correspond topatterns of metal, oxide, or semiconductor layers that make up thevarious components of IC device 860 to be fabricated. The various layerscombine to form various IC features. For example, a portion of IC designlayout diagram 822 includes various IC features, such as an activeregion, gate electrode, source and drain, metal lines or vias of aninterlayer interconnection, and openings for bonding pads, to be formedin a semiconductor substrate (such as a silicon wafer) and variousmaterial layers disposed on the semiconductor substrate. Design house820 implements a proper design procedure to form IC design layoutdiagram 822. The design procedure includes one or more of logic design,physical design or place and route. IC design layout diagram 822 ispresented in one or more data files having information of thegeometrical patterns. For example, IC design layout diagram 822 can beexpressed in a GDSII file format or DFII file format.

Mask house 830 includes mask data preparation 832 and mask fabrication844. Mask house 830 uses IC design layout diagram 822 to manufacture oneor more masks 845 to be used for fabricating the various layers of ICdevice 860 according to IC design layout diagram 822. Mask house 830performs mask data preparation 832, where IC design layout diagram 822is translated into a representative data file (“RDF”). Mask datapreparation 832 provides the RDF to mask fabrication 844. Maskfabrication 844 includes a mask writer. A mask writer converts the RDFto an image on a substrate, such as a mask (reticle) 845 or asemiconductor wafer 853. The design layout diagram 822 is manipulated bymask data preparation 832 to comply with particular characteristics ofthe mask writer and/or requirements of IC fab 850. In FIG. 8 , mask datapreparation 832 and mask fabrication 844 are illustrated as separateelements. In some embodiments, mask data preparation 832 and maskfabrication 844 can be collectively referred to as mask datapreparation.

In some embodiments, mask data preparation 832 includes opticalproximity correction (OPC) which uses lithography enhancement techniquesto compensate for image errors, such as those that can arise fromdiffraction, interference, other process effects and the like. OPCadjusts IC design layout diagram 822. In some embodiments, mask datapreparation 832 includes further resolution enhancement techniques(RET), such as off-axis illumination, sub-resolution assist features,phase-shifting masks, other suitable techniques, and the like orcombinations thereof. In some embodiments, inverse lithographytechnology (ILT) is also used, which treats OPC as an inverse imagingproblem.

In some embodiments, mask data preparation 832 includes a mask rulechecker (MRC) that checks the IC design layout diagram 822 that hasundergone processes in OPC with a set of mask creation rules whichcontain certain geometric and/or connectivity restrictions to ensuresufficient margins, to account for variability in semiconductormanufacturing processes, and the like. In some embodiments, the MRCmodifies the IC design layout diagram 822 to compensate for limitationsduring mask fabrication 844, which may undo part of the modificationsperformed by OPC in order to meet mask creation rules.

In some embodiments, mask data preparation 832 includes lithographyprocess checking (LPC) that simulates processing that will beimplemented by IC fab 850 to fabricate IC device 860. LPC simulates thisprocessing based on IC design layout diagram 822 to create a simulatedmanufactured device, such as IC device 860. The processing parameters inLPC simulation can include parameters associated with various processesof the IC manufacturing cycle, parameters associated with tools used formanufacturing the IC, and/or other aspects of the manufacturing process.LPC takes into account various factors, such as aerial image contrast,depth of focus (“DOF”), mask error enhancement factor (“MEEF”), othersuitable factors, and the like or combinations thereof. In someembodiments, after a simulated manufactured device has been created byLPC, if the simulated device is not close enough in shape to satisfydesign rules, OPC and/or MRC are be repeated to further refine IC designlayout diagram 822.

It should be understood that the above description of mask datapreparation 832 has been simplified for the purposes of clarity. In someembodiments, data preparation 832 includes additional features such as alogic operation (LOP) to modify the IC design layout diagram 822according to manufacturing rules. Additionally, the processes applied toIC design layout diagram 822 during data preparation 832 may be executedin a variety of different orders.

After mask data preparation 832 and during mask fabrication 844, a mask845 or a group of masks 845 are fabricated based on the modified ICdesign layout diagram 822. In some embodiments, mask fabrication 844includes performing one or more lithographic exposures based on ICdesign layout diagram 822. In some embodiments, an electron-beam(e-beam) or a mechanism of multiple e-beams is used to form a pattern ona mask (photomask or reticle) 845 based on the modified IC design layoutdiagram 822. Mask 845 can be formed in various technologies. In someembodiments, mask 845 is formed using binary technology. In someembodiments, a mask pattern includes opaque regions and transparentregions. A radiation beam, such as an ultraviolet (UV) beam, used toexpose the image sensitive material layer (e.g., photoresist) which hasbeen coated on a wafer, is blocked by the opaque region and transmitsthrough the transparent regions. In one example, a binary mask versionof mask 845 includes a transparent substrate (e.g., fused quartz) and anopaque material (e.g., chromium) coated in the opaque regions of thebinary mask. In another example, mask 845 is formed using a phase shifttechnology. In a phase shift mask (PSM) version of mask 845, variousfeatures in the pattern formed on the phase shift mask are configured tohave proper phase difference to enhance the resolution and imagingquality. In various examples, the phase shift mask can be attenuated PSMor alternating PSM. The mask(s) generated by mask fabrication 844 isused in a variety of processes. For example, such a mask(s) is used inan ion implantation process to form various doped regions insemiconductor wafer 853, in an etching process to form various etchingregions in semiconductor wafer 853, and/or in other suitable processes.

IC fab 850 includes wafer fabrication 852. IC fab 850 is an ICfabrication business that includes one or more manufacturing facilitiesfor the fabrication of a variety of different IC products. In someembodiments, IC Fab 850 is a semiconductor foundry. For example, theremay be a manufacturing facility for the front end fabrication of aplurality of IC products (front-end-of-line (FEOL) fabrication), while asecond manufacturing facility may provide the back end fabrication forthe interconnection and packaging of the IC products (back-end-of-line(BEOL) fabrication), and a third manufacturing facility may provideother services for the foundry business.

IC fab 850 uses mask(s) 845 fabricated by mask house 830 to fabricate ICdevice 860. Thus, IC fab 850 at least indirectly uses IC design layoutdiagram 822 to fabricate IC device 860. In some embodiments,semiconductor wafer 853 is fabricated by IC fab 850 using mask(s) 845 toform IC device 860. In some embodiments, the IC fabrication includesperforming one or more lithographic exposures based at least indirectlyon IC design layout diagram 822. Semiconductor wafer 853 includes asilicon substrate or other proper substrate having material layersformed thereon. Semiconductor wafer 853 further includes one or more ofvarious doped regions, dielectric features, multilevel interconnects,and the like (formed at subsequent manufacturing steps).

Details regarding an integrated circuit (IC) manufacturing system (e.g.,system 800 of FIG. 8 ), and an IC manufacturing flow associatedtherewith are found, e.g., in U.S. Pat. No. 9,256,709, granted Feb. 9,2016, U.S. Pre-Grant Publication No. 20150278429, published Oct. 1,2015, U.S. Pre-Grant Publication No. 20140040838, published Feb. 6,2014, and U.S. Pat. No. 7,260,442, granted Aug. 21, 2007, the entiretiesof each of which are hereby incorporated by reference.

A system of one or more computers are configured to perform particularoperations or actions by virtue of having software, firmware, hardware,or a combination of them installed on the system that in operationcauses or cause the system to perform the actions. One or more computerprograms are configured to perform particular operations or actions byvirtue of including instructions that, when executed by data processingapparatus, cause the apparatus to perform the actions. In someembodiments, a method of manufacturing a semiconductor device includesforming via structures in a first via layer over a transistor layer. Theforming via structures in a first via layer includes forming a first viastructure in the first via layer. The first via structure being includedin a first deep via arrangement. In some embodiments, the method alsoincludes forming conductive segments in a first metallization layer overthe first via layer. The forming conductive segments in a firstmetallization layer includes forming M_1st routing segments at least amajority of which, relative to a first direction, have correspondinglong axes with lengths which at least equal if not exceed a firstpermissible minimum value for routing segments in the firstmetallization layer. In some embodiments, the method includes forming anM_1st interconnection segment having a long axis which is less than thefirst permissible minimum value. The M_1st interconnection segment beingincluded in the first deep via arrangement. In some embodiments, themethod also includes forming via structures in a second via layer overthe first metallization layer. The forming via structures in a secondvia layer includes forming a first via structure in the second vialayer. The first via structure being included in the first deep viaarrangement. Other embodiments of this aspect include correspondingcomputer systems, apparatus, and computer programs recorded on one ormore computer storage devices, each configured to perform the actions ofthe methods.

Implementations may include one or more of the following features. Themethod where the forming an M_1st interconnection segment includesaligning the M_1st interconnection segment to substantially overlap thefirst via structure in the first via layer. The forming a first viastructure in the second via layer, includes: aligning the first viastructure in the second via layer to substantially overlap the M_1stinterconnection segment in the first metallization layer. In someembodiments, the method includes forming conductive segments in a secondmetallization layer over the second via layer. The forming conductivesegments in a second metallization layer includes forming an M_2ndrouting segment and aligning the M_2nd routing segment to substantiallyoverlap the first via structure in the second via layer. In someembodiments, the method further includes forming via structures in athird via layer over the first metallization layer. The forming viastructures in a third via layer includes forming a first via structurein the third via layer. The first via structure being included in asecond deep via arrangement. In some embodiments, the method includesforming conductive segments in a third metallization layer over thethird via layer. The forming conductive segments in a thirdmetallization layer includes forming M_3rd routing segments at least amajority of which, relative to the first direction, have correspondinglong axes with lengths which at least equal if not exceed a secondpermissible minimum value for routing segments in the thirdmetallization layer and forming an M_3rd interconnection segment havinga long axis which is less than the second permissible minimum value. TheM_3rd interconnection segment being included in the second deep viaarrangement. In some embodiments, the method includes forming viastructures in a fourth via layer over a transistor layer. The formingthe via structures in a fourth via layer includes forming a first viastructure in the fourth via layer. The first via structure beingincluded in the second deep via arrangement. The forming an M_3rdinterconnection segment includes aligning the M_3rd interconnectionsegment to substantially overlap the first via structure in the thirdvia layer. The forming a first via structure in a fourth via layerfurther includes aligning the first via structure of the fourth vialayer to substantially overlap the M_3rd interconnection segment in thefirst metallization layer. In some embodiments, the method includesforming conductive segments in a fourth metallization layer over thefourth via layer. The forming conductive segments in a fourthmetallization layer includes forming an M_4th routing segment andaligning the M_4th routing segment to substantially overlap the firstvia structure in the fourth via layer. The forming the first via layerfurther includes forming a first shallow via structure in the first vialayer. The forming conductive segments in a first metallization layerfurther includes aligning the M_1st routing segment to substantiallyoverlap the first shallow via structure in the first via layer.Implementations of the described techniques may include hardware, amethod or process, or computer software on a computer-accessible medium.

In some embodiments, a method of manufacturing a semiconductor deviceincludes forming via structures in a first via layer over a transistorlayer. The forming the first via layer includes forming a first viastructure in the first via layer. The first via structure being includedin a first deep via arrangement. In some embodiments, the methodincludes forming conductive segments in a first metallization layer overthe first via layer. The forming conductive segments in the firstmetallization layer includes forming an M_1st interconnection segmenthaving a long axis which is less than a first permissible minimum valuefor M_1st routing segments in the first metallization layer. The M_1stinterconnection segment being included in the first deep viaarrangement. In some embodiments, the method includes forming viastructures in a second via layer over the transistor layer. The formingvia structures in the second via layer includes forming a first viastructure in the second via layer. The first via structure beingincluded in the first deep via arrangement. Other embodiments of thisaspect include corresponding computer systems, apparatus, and computerprograms recorded on one or more computer storage devices, eachconfigured to perform the actions of the methods.

Implementations may include one or more of the following features. Insome embodiments, the forming an M_1st interconnection segment includesaligning the M_1st interconnection segment to substantially overlap thefirst via structure in the first via layer. The forming a first viastructure in the second via layer, includes aligning the first viastructure of the second via layer to substantially overlap the M_1stinterconnection segment in the first metallization layer. In someembodiments, the method includes forming conductive segments in a secondmetallization layer over the second via layer. The forming conductivesegments in a second metallization layer including: forming an M_2ndrouting segments and aligning one M_2nd routing segment to substantiallyoverlap the first via structure in the second via layer. In someembodiments, the method includes forming via structures in a third vialayer over the first metallization layer. The forming via structures ina third via layer includes forming a first via structure in the thirdvia layer. The first via structure being included in a second deep viaarrangement. In some embodiments, the method includes forming conductivesegments in a third metallization layer over the third via layer. Theforming conductive segments in the third metallization layer includesforming an M_3rd interconnection segment having a long axis which isless than a second permissible minimum value for M_3rd routing segmentsin the third metallization layer. The M_3rd interconnection segmentbeing included in the second deep via arrangement and forming viastructures in a fourth via layer over a transistor layer. The formingvia structures in a fourth via layer including: forming a first viastructure in the fourth via layer, the first via structure beingincluded in the second deep via arrangement. The forming an M_3rdinterconnection segment includes: aligning the M_3rd interconnectionsegment to substantially overlap the first via structure in the thirdvia layer. The forming a first via structure in a fourth via layerfurther includes: aligning the first via structure of the fourth vialayer to substantially overlap the M_3rd interconnection segment in thefirst metallization layer. In some embodiments, the method includesforming conductive segments in a fourth metallization layer over thefourth via layer. The forming conductive segments in a fourthmetallization layer includes forming an M_4th routing segments. Theforming conductive segments in the fourth metallization layer over thefourth via layer includes aligning the M_4th routing segment tosubstantially overlap the first deep via arrangement. Implementations ofthe described techniques may include hardware, a method or process, orcomputer software on a computer-accessible medium.

In some embodiments, a method of manufacturing a semiconductor deviceincludes forming via structures in a via layer V(i) over a transistorlayer, where i is a non-negative integer. The forming via structures ina via layer V(i) includes forming a first via structure in the via layerV(i). The first via structure being included in a first deep viaarrangement. In some embodiments, the method includes forming conductivesegments in a metallization layer M(i) over the via layer V(i), where iis a non-negative integer. The forming conductive segments in ametallization layer V(i) includes forming first routing segments atleast a majority of which, relative to a first direction, havecorresponding long axes with lengths which at least equal if not exceeda first permissible minimum value for routing segments in the firstmetallization layer and forming a first interconnection segment having along axis which is less than the first permissible minimum value. Thefirst interconnection segment being included in the first deep viaarrangement. In some embodiments, the method includes forming viastructures in a via layer V(i+1) over the transistor layer. The formingvia structures in a via layer V(i+1) includes forming a first viastructure in the via layer V(i+1). The via structure V(i) being includedin the first deep via arrangement. Other embodiments of this aspectinclude corresponding computer systems, apparatus, and computer programsrecorded on one or more computer storage devices, each configured toperform the actions of the methods.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: forming via structures in a first via layer overa transistor layer, the forming via structures in the first via layerincluding: forming a first via structure in the first via layer, thefirst via structure being included in a first deep via arrangement;forming conductive segments in a first metallization layer over thefirst via layer, the forming theconductive segments in the firstmetallization layer including: forming M_1st routing segments at least amajority of which, relative to a first direction, have correspondinglong axes with lengths which at least equal if not exceed a firstpermissible minimum value for routing segments in the firstmetallization layer; and forming an M_1st interconnection segment havinga long axis which is less than the first permissible minimum value, theM_1st interconnection segment being included in the first deep viaarrangement; and forming via structures in a second via layer over thefirst metallization layer, the forming the via structures in the secondvia layer including: forming a first via structure in the second vialayer, the first via structure being included in the first deep viaarrangement.
 2. The method of claim 1, wherein the forming the M_1stinterconnection segment includes: aligning the M_1st interconnectionsegment to substantially overlap the first via structure in the firstvia layer.
 3. The method of claim 1, wherein the forming the first viastructure in the second via layer, includes: aligning the first viastructure in the second via layer to substantially overlap the M_1stinterconnection segment in the first metallization layer.
 4. The methodof claim 1, the method further comprising: forming conductive segmentsin a second metallization layer over the second via layer, the formingthe conductive segments in the second metallization layer including:forming an M_2nd routing segment; and aligning the M_2nd routing segmentto substantially overlap the first via structure in the second vialayer.
 5. The method of claim 4, the method further comprising: formingvia structures in a third via layer over the first metallization layer,the forming via structures in the third via layer including: forming afirst via structure in the third via layer, the first via structurebeing included in a second deep via arrangement; forming conductivesegments in a third metallization layer over the third via layer, theforming the conductive segments in the third metallization layerincluding: forming M_3rd routing segments at least a majority of which,relative to the first direction, have corresponding long axes withlengths which at least equal if not exceed a second permissible minimumvalue for routing segments in the third metallization layer; and formingan M_3rd interconnection segment having a long axis which is less thanthe second permissible minimum value, the M_3rd interconnection segmentbeing included in the second deep via arrangement; forming viastructures in a fourth via layer over the transistor layer, the formingthe via structures in the fourth via layer including: forming a firstvia structure in the fourth via layer, the first via structure beingincluded in the second deep via arrangement.
 6. The method of claim 5,wherein the forming the M_3rd interconnection segment includes: aligningthe M_3rd interconnection segment to substantially overlap the first viastructure in the third via layer.
 7. The method of claim 5, wherein theforming the first via structure in the fourth via layer furtherincludes: aligning the first via structure of the fourth via layer tosubstantially overlap the M_3rd interconnection segment in the firstmetallization layer.
 8. The method of claim 5, the method furthercomprising: forming conductive segments in a fourth metallization layerover the fourth via layer, the forming the conductive segments in thefourth metallization layer including: forming an M_4th routing segment;and aligning the M_4th routing segment to substantially overlap thefirst via structure in the fourth via layer.
 9. The method of claim 1,wherein the forming the first via layer further includes: forming afirst shallow via structure in the first via layer.
 10. The method ofclaim 9, wherein the forming the conductive segments in the firstmetallization layer further includes: aligning the M_1st routing segmentto substantially overlap the first shallow via structure in the firstvia layer.
 11. A method of manufacturing a semiconductor device, themethod comprising: forming via structures in a first via layer over atransistor layer, the forming the first via layer including: forming afirst via structure in the first via layer, the first via structurebeing included in a first deep via arrangement; forming conductivesegments in a first metallization layer over the first via layer, theforming conductive segments in the first metallization layer including:forming an M_1st interconnection segment having a long axis which isless than a first permissible minimum value for M_1st routing segmentsin the first metallization layer, the M_1st interconnection segmentbeing included in the first deep via arrangement; and forming viastructures in a second via layer over the transistor layer, the formingthe via structures in the second via layer including: forming a firstvia structure in the second via layer, the first via structure beingincluded in the first deep via arrangement.
 12. The method of claim 11,wherein the forming the M_1st interconnection segment includes: aligningthe M_1st interconnection segment to substantially overlap the first viastructure in the first via layer.
 13. The method of claim 11, whereinthe forming the first via structure in the second via layer, includes:aligning the first via structure of the second via layer tosubstantially overlap the M_1st interconnection segment in the firstmetallization layer.
 14. The method of claim 11, the method furthercomprising: forming conductive segments in a second metallization layerover the second via layer, the forming the segments in the secondmetallization layer including: forming an M_2nd routing segments; andaligning one M_2nd routing segment to substantially overlap the firstvia structure in the second via layer.
 15. The method of claim 14, themethod further comprising: forming via structures in a third via layerover the first metallization layer, the forming via structures in thethird via layer including: forming a first via structure in the thirdvia layer, the first via structure being included in a second deep viaarrangement; forming conductive segments in a third metallization layerover the third via layer, the forming the conductive segments in thethird metallization layer including: forming an M_3rd interconnectionsegment having a long axis which is less than a second permissibleminimum value for M_3rd routing segments in the third metallizationlayer, the M_3rd interconnection segment being included in the seconddeep via arrangement; and forming via structures in a fourth via layerover the transistor layer, the forming the via structures in the fourthvia layer including: forming a first via structure in the fourth vialayer, the first via structure being included in the second deep viaarrangement.
 16. The method of claim 15, wherein the forming the M_3rdinterconnection segment includes: aligning the M_3rd interconnectionsegment to substantially overlap the first via structure in the thirdvia layer.
 17. The method of claim 15, wherein the forming the first viastructure in the fourth via layer further includes: aligning the firstvia structure of the fourth via layer to substantially overlap the M_3rdinterconnection segment in the first metallization layer.
 18. The methodof claim 15, the method further comprising: forming conductive segmentsin a fourth metallization layer over the fourth via layer, the formingthe conductive segments in the fourth metallization layer including:forming an M_4th routing segment.
 19. The method of claim 18, whereinthe forming the conductive segments in the fourth metallization layerover the fourth via layer including: aligning the M_4th routing segmentto substantially overlap the first deep via arrangement.
 20. A method ofmanufacturing a semiconductor device, the method comprising: forming viastructures in a via layer V(i) over a transistor layer, where i is anon-negative integer, the forming the via structures in the via layerV(i) including: forming a first via structure in the via layer V(i), thefirst via structure being included in a first deep via arrangement;forming conductive segments in a metallization layer M(i) over the vialayer V(i), where i is a non-negative integer, the forming theconductive segments in the metallization layer M(i) including: formingfirst routing segments at least a majority of which, relative to a firstdirection, have corresponding long axes with lengths which at leastequal if not exceed a first permissible minimum value for routingsegments in the metallization layer M(i); and forming a firstinterconnection segment having a long axis which is less than the firstpermissible minimum value, the first interconnection segment beingincluded in the first deep via arrangement; and forming via structuresin a via layer V(i+1) over the transistor layer, the forming the viastructures in a via layer V(i+1) including: forming a first viastructure in the via layer V(i+1), the via structure V(i) being includedin the first deep via arrangement.